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Mold production and product assembly

Process


SMT basic process elements include: screen printing (or dispensing), mounting (curing), reflow soldering, cleaning, testing, repair


1. Screen printing: its function is to leak the solder paste or patch glue onto the solder pad of PCB to prepare for the welding of components. The equipment used is screen printing machine (screen printing machine), located at the front end of SMT production line.


2, dispensing: it is to drop the glue onto the fixed position of the PCB board, its main role is to fix the components to the PCB board. The equipment used is the dispensing machine, which is located at the front end of the SMT production line or behind the testing equipment.


3. Mounting: its function is to install the surface assembly components on the fixed position of PCB. The equipment used is the mount machine, which is located behind the screen printer in the SMT production line.


4, curing: its role is to melt the patch glue, so that the surface assembly components and PCB board firmly bonded together. The equipment used is the curing furnace, which is located behind the SMT SMT SMT production line.


5. Reflow soldering: its function is to melt the solder paste and make the surface assembly components and PCB board firmly bonded together. The equipment used is a reflow furnace, located behind the SMT SMT SMT SMT line.


6. Cleaning: its function is to remove the welding residues such as flux that are harmful to human body on the assembled PCB board. The equipment used is the cleaning machine, the position can be not fixed, can be online, or not online.


7, detection: its role is to assemble the PCB board for welding quality and assembly quality detection. The equipment used is magnifying glass, microscope, on-line tester (ICT), flying needle tester, automatic optical detection (AOI), X-ray detection system, function tester, etc. The location can be configured in the appropriate place of the production line according to the needs of testing.


8, repair: its role is to detect the failure of PCB board for rework. The tools used are soldering iron, repair workstation, etc. Configuration anywhere in the production line.

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